Substrate for semiconductor device, semiconductor device using the same, and method for manufacture thereof
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United States of America Patent
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-
Feb 8, 2000
Issued Date -
N/A
app pub date -
May 28, 1998
filing date -
May 10, 1996
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A one-sided sealed type semiconductor device comprising a substrate proper for a one-sided resin mold provided on the first main surface thereof with a wiring circuit including connection parts for semiconductor elements and on the second main surface thereof with flat type external connection terminals led out thereon via a through hole, semiconductor elements set in place and packaged in predetermined areas of the first main surface of the substrate proper, a transfer mold resin layer for sealing solely the surface having the semiconductor elements packaged thereon, and a metallic layer formed on the first main surface independently of wiring circuit and outside the area having the wiring circuit.
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