Vapor deposition routes to nanoporous silica
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United States of America Patent
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Feb 8, 2000
Grant Date -
N/A
app pub date -
Jul 7, 1998
filing date -
Jul 7, 1998
priority date (Note) -
Expired
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Abstract
A process for the manufacture of nanoporous silica dielectric films by vapor deposition of silica precursors on a substrate. The process provides for vaporizing at least one alkoxysilane composition; depositing the vaporized alkoxysilane composition onto a substrate; exposing the deposited alkoxysilane composition to a water vapor, and either an acid or a base vapor; and drying the exposed alkoxysilane composition, thereby forming a relatively high porosity, low dielectric constant, silicon containing polymer composition on the substrate.
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