Method for using photoabsorptive coatings and consumable copper to control exit via redeposit as well as diameter variance
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United States of America Patent
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Feb 8, 2000
Grant Date -
N/A
app pub date -
Nov 8, 1996
filing date -
Nov 8, 1996
priority date (Note) -
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Abstract
A method of forming a through-via in a laminated substrate by applying a polymeric photo-absorptive layer on an exposed bottom surface of a laminated substrate. A through-via is laser drilled in the substrate from a top of the substrate through the substrate to a bottom of the substrate. The photo-absorptive layer formed on the bottom surface of the substrate is then removed.
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