Structure for a thin film multilayer capacitor

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6023407
SERIAL NO

09031235

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electronic component structure is proposed, wherein an interposer thin film capacitor structure is employed between an active electronic component and a multilayer circuit card. A method for making the interposer thin film capacitor is also proposed. In order to eliminate fatal electrical shorts in the overlying thin film regions that arise from pits, voids, or undulations on the substrate surface, a thick first metal layer, on the order of 0.5-10 .mu.m thick, is deposited on the substrate upon which the remaining thin films, including a dielectric film and second metal layer, are then applied. The first metal layer includes of Pt or other electrode metal, or a combination of Pt, Cr, and Cu metals, and a diffusion barrier layer. Additional Ti layers may be employed for adhesion enhancement. The thickness of the first metal layers are approximately: 200 A for the Cr layer; 0.5-10 .mu.m for the Cu layer; 1000 A-5000 A for the diffusion barrier; and 100 A-2500 A for a Pt layer.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK, NY46918

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Farooq, Mukta S Hopewell Junction, NY 17 566
Farooq, Shaji Hopewell Junction, NY 40 750
Hamel, Harvey C Poughkeepsie, NY 14 286
Knickerbocker, John U Hopewell Junction, NY 177 2243
Rita, Robert A Wappingers Falls, NY 31 393
Stoller, Herbert I Wappingers Falls, NY 23 563

Cited Art Landscape

Patent Info (Count) # Cites Year
 
LUCENT TECHNOLOGIES INC. (1)
* 5936831 Thin film tantalum oxide capacitors and resulting product 39 1997
 
SMITHS INTERCONNECT MICROWAVE COMPONENTS, INC. (1)
* 5598131 AC coupled termination 8 1995
 
COHEN, MARVIN S. (1)
* 5326016 Method for removing electrical components from printed circuit boards 7 1993
 
E. I. DU PONT DE NEMOURS AND COMPANY (1)
* 4954926 Thick film conductor composition 22 1989
 
VENTURE LENDING DIVISION OF THE CUPERTINO NATIONAL BANK (1)
* 5640699 Mixer constructed from thick film balanced line structure 14 1996
 
SIEMENS AKTIENGESELLSCHAFT (1)
* 4615908 Method for the manufacture of plasma-polymer multilayer capacitors 8 1985
 
KYOCERA AMERICA, INC. (1)
* 5134246 Ceramic-glass integrated circuit package with integral ground and power planes 11 1991
 
KABUSHIKI KAISHA TOSHIBA (1)
* 4572843 Method for producing a capacitor with precise capacitance 32 1985
 
BELL TELEPHONE LABORATORIES, INCORPORATED (1)
* 4374159 Fabrication of film circuits having a thick film crossunder and a thin film capacitor 8 1981
 
THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK (1)
* 5587870 Nanocrystalline layer thin film capacitors 71 1994
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (3)
* 6339527 Thin film capacitor on ceramic 23 1999
6768650 Method and structure for reduction of impedance using decoupling capacitor 8 2002
* 2003/0147,226 Method and structure for reduction of impedance using decoupling capacitor 3 2002
 
QUALCOMM INCORPORATED (28)
8178435 High performance system-on-chip inductor using post passivation process 6 2003
* 7531417 High performance system-on-chip passive device using post passivation process 11 2003
* 2004/0029,404 High performance system-on-chip passive device using post passivation process 27 2003
8421158 Chip structure with a passive device and method for forming the same 3 2004
8008775 Post passivation interconnection structures 2 2004
7960269 Method for forming a double embossing structure 9 2006
* 2007/0045,855 Method for forming a double embossing structure 8 2006
* 2007/0202,684 High performance system-on-chip inductor using post passivation process 13 2007
* 2007/0202,685 High performance system-on-chip inductor using post passivation process 11 2007
* 2007/0182,521 High performance system-on-chip inductor using post passivation process 12 2007
8531038 Top layers of metal for high performance IC's 1 2007
7999384 Top layers of metal for high performance IC's 6 2007
* 2007/0262,457 Top layers of metal for high performance IC's 84 2007
7884479 Top layers of metal for high performance IC's 4 2007
8471384 Top layers of metal for high performance IC's 0 2007
8415800 Top layers of metal for high performance IC's 0 2007
* 2007/0290,348 Top layers of metal for high performance IC's 6 2007
* 2008/0038,869 High performance system-on-chip using post passivation process 5 2007
* 2008/0035,972 High performance system-on-chip using post passivation process 7 2007
8487400 High performance system-on-chip using post passivation process 1 2007
7973629 Method for making high-performance RF integrated circuits 3 2007
8018060 Post passivation interconnection process and structures 1 2008
8022545 Top layers of metal for high performance IC's 3 2008
8384189 High performance system-on-chip using post passivation process 0 2008
* 2008/0284,032 High performance system-on-chip using post passivation process 2 2008
7863654 Top layers of metal for high performance IC's 8 2008
8384508 Method for making high-performance RF integrated circuits 0 2011
* 2011/0175,195 METHOD FOR MAKING HIGH-PERFORMANCE RF INTEGRATED CIRCUITS 0 2011
 
SONY CORPORATION (2)
6974909 IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC module 18 2003
6963028 IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC wireless 2 2005
 
MEGICA CORPORATION (1)
* 2007/0181,970 High performance system-on-chip inductor using post passivation process 11 2007
 
NGK SPARK PLUG CO., LTD. (5)
* 6952049 Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor 84 2000
6885541 Capacitor, and capacitor manufacturing process 9 2004
* 2004/0264,103 Capacitor, and capacitor manufacturing process 3 2004
7239014 Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor 18 2005
* 2005/0258,548 Capacitor-built-in-type printed wiring substrate printed wiring substrate, and capacitor 11 2005
 
Ultrasource, Inc. (9)
6761963 Integrated thin film capacitor/inductor/interconnect system and method 21 2001
6998696 Integrated thin film capacitor/inductor/interconnect system and method 8 2003
6890629 Integrated thin film capacitor/inductor/interconnect system and method 10 2003
7327582 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
* 2005/0175,938 Integrated thin film capacitor/inductor/interconnect system and method 3 2005
7425877 Lange coupler system and method 1 2005
* 2005/0162,236 Lange coupler system and method 2 2005
7446388 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
* 2006/0097,344 Integrated thin film capacitor/inductor/interconnect system and method 0 2005
 
INTEL CORPORATION (12)
* 6801422 High performance capacitor 13 1999
6724611 Multi-layer chip capacitor 86 2000
6770969 High performance capacitor 7 2002
* 2002/0071,258 High performance capacitor 2 2002
* 7027289 Extended thin film capacitor (TFC) 9 2004
* 2005/0213,281 EXTENDED THIN FILM CAPACITOR (TFC) 1 2004
7029962 Methods for forming a high performance capacitor 0 2004
* 2005/0007,723 Methods for forming a high performance capacitor 6 2004
* 7123466 Extended thin film capacitor (TFC) 4 2005
7670919 Integrated capacitors in package-level structures, processes of making same, and systems containing same 0 2005
* 2007/0158,818 Integrated capacitors in package-level structures, processes of making same, and systems containing same 2 2005
7989916 Integrated capacitors in package-level structures, processes of making same, and systems containing same 0 2009
 
SAMSUNG ELECTRO-MECHANICS CO., LTD. (2)
* 7293356 Method of fabricating printed circuit board having embedded multi-layer passive devices 74 2006
* 2006/0203,456 Method of fabricating printed circuit board having embedded multi-layer passive devices 0 2006
 
BOARD OF TRUSTEES OF THE UNIVERSITY OF ARKANSAS (1)
6707680 Surface applied passives 17 2002
 
FUJITSU LIMITED (4)
7456078 Thin-film capacitor and method for fabricating the same, electronic device and circuit board 0 2006
* 2007/0141,800 Thin-film capacitor and method for fabricating the same, electronic device and circuit board 3 2006
7855458 Electronic component 1 2006
* 2007/0158,848 Electronic component 1 2006
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
* 6903917 Substrate-embedded capacitor, production method thereof, and circuit board 2 2003
* Cited By Examiner