Cooling structure for multi-chip module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 8, 2000
Grant Date -
N/A
app pub date -
Feb 3, 1998
filing date -
Feb 3, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A cooling structure for a multi-chip module includes a multi-chip module, a fan-builtin heat sink, a cooling fan, and openings. In the multi-chip module, a plurality of chips are mounted on a wiring board. The heat sink has a bottom plate and is arranged above the multi-chip module. The cooling fan is arranged in an upper portion of the heat sink to cool the multi-chip module. The openings are formed in a bottom plate of the heat sink to supply air from the cooling fan to the multi-chip module.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully