Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile
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United States of America Patent
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Feb 15, 2000
Issued Date -
N/A
app pub date -
Aug 27, 1992
filing date -
May 22, 1989
priority date (Note) -
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Abstract
A magentron sputtering apparatus includes a rotatable magnet which is either concave or convex. For one magnet structure, at least a portion of the centerline of the magnet lies along a curve defined by ##EQU1## where .xi.(r) is a preselected erosion profile. When stationary, the magnet generates a localized magnetic field of approximately constant width. In operation, when the magnet is rotated, it generates the preselected erosion profile in the target. The preselected erosion profile may be constant.
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