Smart cards having glue-positioned electronic components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Feb 15, 2000
Issued Date -
N/A
app pub date -
Oct 21, 1998
filing date -
Sep 8, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Smart cards having high quality external surfaces can be made through the use of partially cured, low shrinkage glues to hold the smart card's electronic elements during their immersion in a thermosetting material that becomes the core layer of said cards. Mounds of low shrinkages give serve to hold the electronic component in a given position in the core layer.
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Cited Art Landscape
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