Semiconductor device including a frame terminal
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United States of America Patent
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-
Feb 15, 2000
Issued Date -
N/A
app pub date -
Oct 30, 1997
filing date -
Aug 24, 1994
priority date (Note) -
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status (Latency Note)
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Abstract
This invention relates to a semiconductor device in which a plurality of outer terminals are arranged in a lattice formation on a flat surface. The semiconductor device comprises a semiconductor chip having a plurality of pads, a resin portion sealing said semiconductor chip and a terminal portion in which a prescribed number of pole terminals electrically connected to said pads provided in said semiconductor chip are provided, said pole terminals being exposed from said resin portion. According to the invention, a cost for production is reduced and a reliability and electrical characteristics can be improved.
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