Resist process method and system

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United States of America Patent

PATENT NO 6027262
SERIAL NO

08921350

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Abstract

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A resist process method includes the steps of, preparing a process section for processing a wafer, means for extracting the wafer from a cassette and conveying the substrate to the process section, a cleaning section for finally cleaning the wafer processed by the process section, means for transferring the wafer from the process section to the cleaning section, and means for receiving the wafer from the cleaning section and storing the wafer in a cassette, extracting the wafer from the cassette, conveying the extracted wafer to the process section, causing the process section to include at least a process of developing the resist coated onto the wafer, transferring the wafer from the process section to the cleaning section after at least the developing process, finally cleaning the non-resist coated surface of the wafer by applying a cleaning solution to at least the non-resist coated surface of the substrate in the cleaning section, and storing the finally cleaned wafer in the cassette.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 107-6325

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akimoto, Masami Kumamoto-ken, JP 112 3903

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