Electroplating system with shields for varying thickness profile of deposited layer
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United States of America Patent
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Feb 22, 2000
Grant Date -
N/A
app pub date -
Nov 13, 1997
filing date -
Nov 13, 1997
priority date (Note) -
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Abstract
An electroplating system includes shield(s) to control the thickness profile of a metal electrodeposited onto a substrate. The shield(s) are positioned between the anode and the cathode in a standard electroplating apparatus with a device for rotating the plating surface. The cathode is rotated so that the shield(s) in conjunction with the rotation of the cathode selectively alters or modulates a time average of the electric field characteristics between the anode and the cathode. The modulated electric field is used to control the electrodeposition rate at selected area(s) of the plating surface of the cathode, thereby causing the metal deposited on the cathode to have a modified thickness profile.
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