Wafer product and process of manufacture
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 22, 2000
Grant Date -
N/A
app pub date -
Feb 19, 1998
filing date -
Feb 27, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A crisp, approximately circular wafer product is provided whereby the two surfaces of the wafer each have a pattern formed by ridges, the first surface having a pattern comprising at least two grid patterns superimposed on each other, one grid being at an angle of approximately 45.degree. to the other, the second surface having a single grid pattern, the pattern being at 45.degree. to the lower grid on the first surface.
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Cited Art Landscape
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