Process for controlling the height of a stud intersecting an interconnect
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Feb 22, 2000
Grant Date -
N/A
app pub date -
Jan 6, 1998
filing date -
Jan 6, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Electrical interconnection with studs is formed by depositing conductive stud material in contact holes in a dielectric layer; patterning the conductive stud material and removing a shallow portion of the dielectric layer surrounding the stud material; depositing a thin layer of dielectric material over the conductive stud and first dielectric layer; forming a trench in the dielectric layers and over the top of the stud material; and depositing conductive material in the trench.
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