Re-routing lead frame package and semiconductor memory package using the same
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United States of America Patent
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Feb 22, 2000
Grant Date -
N/A
app pub date -
Jul 2, 1999
filing date -
Jul 2, 1999
priority date (Note) -
Expired
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Abstract
The present invention discloses a semiconductor memory stack including two semiconductor memory packages stacked together. The semiconductor memory packages are electrically connected by pins. At least one of the semiconductor memory packages has a lead frame provided with a re-routing pin connected to a laterally extended conductive layer. According to the present invention, a memory device with a larger capacity can be obtained by stacking two semiconductor memory packages with a smaller capacity, thereby reducing the cost and simplifying the manufacturing process.
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