Integrated circuit package and method of fabrication
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Feb 22, 2000
Grant Date -
N/A
app pub date -
Mar 30, 1998
filing date -
Mar 30, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention is directed to a semiconductor package and its method of manufacture. Conductors mounted on a flexible polymer tape are used to connect a semiconductor chip to a substrate. The flexible polymer tape can be folded back under the chip to reduce the size necessary for mounting the assembly to almost that of the chip itself. The polymer tape also provides flexibility to reduce stresses on the electrical connections caused by thermal expansion and compression. Additionally, the present invention allows for the stacking of semiconductor chips on top of one another, reducing signal propagation delays between them.
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