Method and apparatus for handling semiconductor chips
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Feb 29, 2000
Grant Date -
N/A
app pub date -
Apr 5, 1999
filing date -
Apr 5, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
An apparatus and a method for receiving and transporting semiconductor chips. The chips are placed in pockets on a top surface of a first carrier. A similar carrier has an adhesive sheet placed on its top surface, and it is inverted and placed on the first carrier. A vacuum is pulled on orifices leading to the pockets. The vacuum pulls the flexible sheet into contact with the chips. The second carrier is then removed from the first carrier. Air pressure may be introduced to assist in the removal. A cover may be placed over the second carrier.
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