Bondable compliant pads for packaging of a semiconductor chip and method therefor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Feb 29, 2000
Grant Date -
N/A
app pub date -
Jun 10, 1997
filing date -
Jun 10, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
A method of making a microelectronic package includes providing first and second microelectronic elements having electrically conductive parts and disposing a resilient element having one or more intermediary layers capable of being wetted by an adhesive between the microelectronic elements. The resilient element includes fibrous material, a fibrous matrix and/or voids formed at the intermediary layers thereof. An adhesive is provided between the intermediary layers and the microelectronic elements. The adhesive is then cured while it remains in contact with the intermediary layers for bonding the resilient element and the microelectronic elements. The electrically conductive parts are then bonded together to form electrical interconnections. A microelectronic package comprising a resilient element including one or more intermediary layers capable of being wetted by an adhesive is also provided.
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