Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers
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United States of America Patent
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Feb 29, 2000
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app pub date -
Jul 29, 1999
filing date -
Aug 16, 1996
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Abstract
An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which contact the wafer surface in combination with a reactive liquid solution free from particulate matter.
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