Non-destructive method for gauging undercut in a hidden layer
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United States of America Patent
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Feb 29, 2000
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N/A
app pub date -
Nov 5, 1998
filing date -
Nov 5, 1998
priority date (Note) -
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Abstract
A method for non-destructively determining the amount of undercutting in a hidden layer of material disposed on a substrate after device patterning by etching. The method involves forming at least two lines of etch resistant material of increasing width over the hidden layer of material of the substrate and inspecting the lines after etching for a given time period to determine how many lines have been removed. The width dimension of the largest removed line corresponds approximately to the amount of undercut for two sides in the hidden layer of material after etching for the given time period.
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