IC testing method and apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 29, 2000
Grant Date -
N/A
app pub date -
Dec 22, 1997
filing date -
Dec 25, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Two contact heads are used to convey IC devices between an IC device testing part E and a contact arm operating stage ST3 and a buffer stage ST4 is interposed between the contact arm operating stage ST3, a loader arm operating stage ST1 and an unloader arm operating stage ST2 and is movable in X-direction. On the buffer stage ST2 are disposed a loader buffer carrier and an unloader buffer carrier, the former transfers untested IC devices from the loader arm operating stage ST1 to the contact arm operating stage ST3 and the latter transfers tested IC devices from the contact arm operating stage ST3 to the unloader arm operating stage ST3.
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