Method of forming thermal conductive structure on printed circuit board
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United States of America Patent
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Mar 7, 2000
Grant Date -
N/A
app pub date -
Aug 6, 1998
filing date -
Apr 22, 1998
priority date (Note) -
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Abstract
A method of manufacturing a thermal conductive structure on a printed circuit board comprises the steps of forming a thermal conductive layer having an embossed pattern on its surface, and then forming an adhesive glue layer over the thermal conductive layer. Next, a surface metallic layer is attached to the thermal conductive layer and the glue layer, wherein a portion of the surface metallic layer corresponding to the embossed portion of the heat spreader is in direct contact or almost direct contact with the thermal conductive layer. Furthermore, an additional external heat sink can be attached to thermal conductive structure for increasing the efficiency of heat dissipation.
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