Method for attaching a removable tape to encapsulate a semiconductor package
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United States of America Patent
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-
Mar 7, 2000
Grant Date -
N/A
app pub date -
Jul 17, 1997
filing date -
Feb 14, 1997
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A method for fabricating a semiconductor package having a semiconductor chip and leads attached to the chip includes the steps of placing a tape over the leads attached to the semiconductor chip, forming a mold to encapsulate the semiconductor chip and the leads while exposing a portion of the leads contacting the tape, and removing the tape over the leads after the mold forming step.
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