Bonding-option architecture for integrated circuitry
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United States of America Patent
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Mar 7, 2000
Grant Date -
N/A
app pub date -
Mar 25, 1998
filing date -
Nov 20, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A bonding-option architecture is provided for use on an IC package for bonding option selections. The bonding-option architecture includes an option pad and a plurality of bonding entries connected to the option pad, each of the bonding entries being arranged in immediate proximity to one of the bonding points. In this bonding-option architecture, at least a first one of the bonding points is connected via a first one of the pins to an external power point and at least a second one of the bonding points is connected via a second one of the pins to an external ground point when the IC package is mounted on a circuit board. In the case when a high-voltage state logic signal is to be set via the option pad into the internal circuit of the IC chip, the first one of the bonding points is wired to the proximate one of the bonding entries; and in the case when a low-voltage state logic signal is into be set via the option pad to the internal circuit of the IC chip, the second one of the bonding points is wired to the proximate one of the bonding entries.
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