Process to create metallic stand-offs on an electronic circuit

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United States of America Patent

PATENT NO 6036836
SERIAL NO

08994805

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A process to create metallic stand-offs or studs on a printed circuit board (PCB). The process allows to obtain studs constituted by three successive layers of metal (Cu1, Cu2 and Cu3 or Ni) of which at least the two first layers are made of copper. The height of the so-created stand-off is sufficient to use it in the flip chip technology to assemble chips to a printed circuit board. The present process is implemented according either to the electro-plating (galvano-plating) or to the electrochemical-plating technique.

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Patent Owner(s)

Patent OwnerAddress
ST MICROELECTRONICS N VWTC SCHIPHOL AIRPORT 1118 BH SCHIPHOL AIRPORT AMSTERDAM

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ackaert, Ann Marie Acacialaan 18, B-9080 Lochristi, BE 1 15
Allaert, Koenraad Juliaan Georges Haachtsebann 136, B-3140 Keerbergen, BE 1 15
De, Baets Johan Uilkensstraat 11, B-9000 Gent, BE 2 19
Peeters, Joris Antonia Franciscus Groenenborgerlaan 103, B-2610 Wilrijk, BE 1 15
Van, Calster Andre Michel Grote Reukens 14, B-9070 Heusden, BE 1 15
Vandam, Louis Joseph d'Outermontlei 5, B-2930 Brasschaat, BE 1 15
Vandevelde, Bart Leo Alfons Maurice 't Meilrijk 94, B-3290 Diest, BE 1 15
Vereeken, Maria Eugenie Andre Vijverstraat 18, B-9030 Mariakerke, BE 1 15
Zhang, Suixin Sint-Pietersnieuwstraat 41, B-9000 Gent, BE 2 37

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