Importance

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Abstract

Packaging of high resolution linear solid state image sensors can result in a significant cost savings over conventional packaging processes, while adding several features. Cost reduction is accomplished by drastically reducing the cover glass size, eliminating the need for rounded corners as well as need for an epoxy ring on the cover glass, and integrating a wire bond light shield into the IC package. Additional cost savings are realized by eliminating the thermal cure cycle presently required to attach the cover glass, a process which can take several hours to completed. The invention replaces the conventional IC package with a two piece assembly. The bottom piece is a low profile plastic or ceramic IC package and the top piece is an inexpensive molded piece which serves as a cap with an integrated light shield aperture and cover glass holder.

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First Claim