Multichip module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Mar 14, 2000
Grant Date -
N/A
app pub date -
Dec 20, 1996
filing date -
Dec 20, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device which includes a first semiconductor chip mounted on top of a lead frame which is molded within a plastic body. During the molding process a cavity is formed on the bottom of the lead frame. After testing or burn-in of the first chip a second semiconductor chip is mounted and electrically connected to the lead frame. The second chip may then be sealed within the cavity to form a multichip module.
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