Mounting assembly of integrated circuit device and method for production thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 14, 2000
Grant Date -
N/A
app pub date -
Mar 2, 1998
filing date -
Mar 3, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A mounting assembly of an integrated circuit device includes an integrated circuit device having pads on its lower side, through holes formed in a mounting substrate at positions opposed to the pads of the integrated circuit device, and solders for connecting the pads of the integrated circuit device with the through holes. An electrode is provided on the inside wall of each through hole, and the mounting substrate includes therein wirings connected to the electrodes. The solder is filled into the through holes to such an extent that the solder filled in the through holes can be visually checked from the lower side of the substrate.
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