Electrical component mounting assembly including special guide structure for receiving a component package regardless of orientation of the package relative to the guides
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 14, 2000
Grant Date -
N/A
app pub date -
Jan 13, 1998
filing date -
Jan 13, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A mounting structure for mounting circuit components on circuit boards, and particularly for mounting packaged processors on computer mother-boards. The structure includes a pair of retractable guides for mounting the processor package onto the circuit board. The semi-finished circuit board can be prepared for further processing or transportation to a distant location by retracting the guides to greatly reduce the height and volume of each board. Then, when the boards are received, the guides can be erected and the processor package installed. The structure includes means for holding the guides erected to facilitate installation of the processor package, and holding the guides in folded position for processing and/or transportation. Also, each of the guides has a wall with two side-by-side latch openings for receiving offset latch members of the processor package regardless of the orientation of the package relative to the guides.
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