Wiring board and semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 14, 2000
Grant Date -
N/A
app pub date -
Jan 25, 1996
filing date -
Jun 30, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A wiring board to be provided between a packaged electronic component having an integrated circuit and a mother board on which the packaged electronic component should be mounted, includes a base made of an insulating material, a first circuit pattern which is provided on a first surface of the base and has terminals connectable to terminals of the packaged electronic component for external connections, and a second circuit pattern which is provided on a second surface of the base opposite to the first surface thereof and has terminals connectable to terminals provided on the mother board.
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