Ink jet heater chip module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 21, 2000
Grant Date -
N/A
app pub date -
Jun 19, 1998
filing date -
Jun 19, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A heater chip module is provided comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support substrate having at least one passage which defines a path for ink to travel from the container to the heater chip. The heater chip is secured at its base to a portion of the support substrate. At least the portion of the support substrate is formed from a material having substantially the same coefficient of thermal expansion as the heater chip base. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.
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Family
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Cited Art Landscape
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