Polishing method, abrasive material, and polishing apparatus

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United States of America Patent

PATENT NO 6039631
SERIAL NO

09065444

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed is a polishing method including the step of: polishing a surface of a member to be polished by rotating and sliding an abrasive wheel holding fixed abrasive grains on the surface of the wheel while supplying free abrasive grains to the surface of the member to be polished; wherein the abrasive wheel is formed by binding the fixed abrasive grains with a soft binder and a pore forming agent. This polishing method is effective to obtain a high flatness of a polished surface and improve surface characteristics of the polished surface, and also to obtain a high continuous-workability by stably keeping a polishing ability for a long period of time.

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Patent Owner(s)

Patent OwnerAddress
SONY CORPORATION1-7-1 KONAN MINATO-KU TOKYO 1080075 ?1080075

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ohtorii, Hiizu Tokyo, JP 27 165
Sato, Shuzo Kanagawa, JP 50 991

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