Method of and apparatus for laminating a semiconductor wafer with protective tape
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 21, 2000
Grant Date -
N/A
app pub date -
Jul 13, 1998
filing date -
Jul 25, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor wafer tape laminating system includes a loading device for conveying a wafer or cassette to a predetermined location where a laminating process is performed. A laminating device attaches UV tape to the front surface of the wafer conveyed by the loading device. A precutting device having a knife cuts the UV tape around the wafer as spaced therefrom to leave an edge of the tape protruding beyond the peripheral edge of the wafer. A wire cutting device having a wire removes the edge of the UV tape left around the wafer by the precutting device. An ultra-violet illuminator irradiates the edge of the UV tape with ultra-violet rays, and an unloading device carries the wafer to a downstream processing station. When the edge of the UV tape is irradiated with ultra-violet rays, it loses its adhesive strength. Accordingly, the edge will not attach itself to the wafer or to a piece of processing equipment after it is removed by the wire cutting device.
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