Ultra-high vacuum apparatus and method for high productivity physical vapor deposition.
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United States of America Patent
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Mar 21, 2000
Issued Date -
N/A
app pub date -
Oct 27, 1997
filing date -
Jul 10, 1995
priority date (Note) -
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Abstract
A magnetron sputtering system is provided that uses a backing plate assembly having an insulating spacer ring coupled between and hermetically sealed to the backing plate and an extender ring. The insulating spacer ring can be constructed from a ceramic material, and the extender ring can be constructed from a metal material. The use of this backing plate assembly allows the backing plate assembly to be coupled directly to the chamber walls with a metal-to-metal contact, while the backing plate remains electrically isolated from the chamber walls. This allows the sealing of a vacuum chamber in the magnetron sputtering system using a seal suitable for creating an ultra-high vacuum in the vacuum chamber.
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