Thermal processing apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6040120
SERIAL NO

09014485

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Abstract

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A substrate processing apparatus and a thermal processing apparatus are capable of creating a pattern with an excellent line width uniformity. An ACU conditions air to a temperature and a humidity which are suitable to processing which uses a resist of chemical thickening type, while an ammonia removing filter removes an ammonia component from the air and the air is supplied to an air supply pipe which branches off. A pump, a flow meter and a pressure regulator are disposed to an air supply pipe, so that the air from the ACU, as it is conditioned to flow at a constant flow rate and with a pressure, is supplied to a PEB bake unit. Since the temperature and the humidity of an atmosphere within the PEB bake unit stabilize at values which are suitable to processing which uses a resist of chemical thickening type, it is possible to form a pattern with an excellent line width uniformity. At the same time, it is possible to suppress a development failure since the atmosphere contains a reduced quantity of ammonia component.

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Patent Owner(s)

Patent OwnerAddress
SCREEN HOLDINGS CO LTDTENJINKITA-MACHI 1-1 TERANOUCHI-AGARU 4-CHOME HORIKAWA-DORI KAMIGYO-KU KYOTO-SHI KYOTO 602-8585

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsushita, Masanao Kyoto, JP 2 27
Taniguchi, Hideyuki Kyoto, JP 12 448

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