Semiconductor device package and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Mar 21, 2000
Grant Date -
N/A
app pub date -
Oct 2, 1997
filing date -
Oct 2, 1997
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A chip scale power semiconductor device (16) provides improved heat dissipation. A semiconductor die (19) is mounted in a first region of a substrate (18). The substrate is extended to a second region for disposing terminals (38) to make external connections to the semiconductor device. Conductors (34) formed on the substrate electrically couple the semiconductor die to the terminals. The substrate is extended for a predetermined distance to separate the second region from the first region for isolating the temperature of the semiconductor die from the local temperature at the terminals.
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