Waveguide to microstrip backshort with external spring compression
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United States of America Patent
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Mar 21, 2000
Grant Date -
N/A
app pub date -
Sep 2, 1998
filing date -
Sep 2, 1998
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Abstract
A new amplifier module construction enhances the manufacturer's ability to repetitively construct multiple copies of millimeter microwave amplifiers having performance characteristics that are consistent with one another, particularly in input VSWR ratio characteristic, and which performance characteristic do not significantly change following any necessary rework of the amplifier module, including any MMIC chip replacement. In this module, a waveguide to microstrip transition is formed of a backshort member that is separate from the metal base or cover and that backshort member is held pressed in place against the substrate by force exerted by the module's cover plate through a spring member against the exterior of the backshort member. The spring member is formed by a resilient compressible gasket.
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