Printed circuit board with opposed bonding shelves for semiconductor chip wire bonding at different levels
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 21, 2000
Grant Date -
N/A
app pub date -
Feb 26, 1997
filing date -
Feb 27, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
High density bonding pads in a printed circuit board for mounting a semiconductor chip are provided using a simple structure and at a low cost, while minimizing the difference in levels of bonding pads. A printed circuit board for mounting semiconductor chip(s) includes conductive traces on both sides of a base material, the first traces on a first surface of the base material having first bonding pads, the second traces on a second opposite surface of the base material having the second bonding pads. The bonding pads are located in rows adjacent each other with the base material having openings leading to the second bonding pads, such that chip bonding wires are connectible from the chip directly to the first bonding pads and through the openings to the second bonding pads.
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