Atomic layer deposition apparatus for depositing atomic layer on multiple substrates
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United States of America Patent
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Mar 28, 2000
Grant Date -
N/A
app pub date -
Sep 7, 1999
filing date -
May 1, 1999
priority date (Note) -
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Abstract
An atomic layer deposition (ALD) apparatus capable of depositing a thin film on a plurality of substrates. The atomic layer deposition apparatus includes: a vacuum chamber, a reactor installed in the vacuum chamber, having a plurality of modules which can be assembled and disassembled as desired, a plurality of stages as spaces partitioned by assembling the plurality of modules, and openings which allow each stage to receive one substrate; a gas supply portion installed in the reactor, for supplying reaction gases and a purging gas to the reactor; and a plurality of gas supply lines installed in the modules, for injecting the gases from the gas supply portion into the stages.
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