Multiple wire printed circuit board and process for making the same
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United States of America Patent
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-
Mar 28, 2000
Issued Date -
N/A
app pub date -
Nov 16, 1998
filing date -
May 26, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A multiple wire printed circuit board including printed conductor circuit layers, adhesive layers with wires having insulating coating embedded and fixed therein, insulating layers, and connecting through-holes formed at locations where connections will be made, wherein the conductor circuit layers are insulated from other circuit conductors, and the difference in glass transition point between each adhesive layer and the adjoining insulating layer is within the range of 60.degree. C., remains free of peel and voids despite heat history applied to the board, and is capable of high-density wiring, multiplication of circuit layers and a reduction of the number of the manufacturing steps.
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