Apparatus for controlling plating over a face of a substrate
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United States of America Patent
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-
Mar 28, 2000
Issued Date -
N/A
app pub date -
May 21, 1998
filing date -
May 26, 1995
priority date (Note) -
In Force
status (Latency Note)
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Abstract
According to one aspect of the invention, a plating system is provided which includes a tank for containing a plating solution, a substrate holder, and a temperature control device. The substrate holder is configured to support a substrate in position so that at least a first face of the substrate is exposed to the plating solution in the tank. The temperature control device provides selective control of temperature in various regions of the substrate during plating so as to control plating over the first face of the substrate.
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