Method of calibrating WEE exposure tool

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United States of America Patent

PATENT NO 6042976
SERIAL NO

09245561

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention provides four sub-patterns located at the periphery of the wafer surface at 90-degree intervals. Each of the four sub-patterns is divided into four alignment scales where each alignment scale is yet again subdivided into a multiplicity of alignment marks. This multiplicity of sub-patterns and alignment scales with each scale having a multiplicity of alignment marks results in very accurate and convenient alignment capability.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Yung-Dar Hsin-Chu, TW 13 95
Chiang, Wen-Chong Taichung County, TW 1 24
Hsiue, Jung-Hau Hsin-Chu, TW 1 24
Shih, Shih-Chang Hsin-Chu, TW 19 83

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