US Patent No: 6,045,026
Number of patents in Portfolio can not be more than 2000
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
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Apr 4, 2000
Issued date -
Feb 23, 1998
filing date -
09/027,690
serial no -
In Force
status
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Abstract
A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.
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First Claim
Related Publications
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
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| 5,326,428 Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability | 220 | 1993 | |
| 5,478,779 Electrically conductive projections and semiconductor processing method of forming same | 88 | 1994 | |
| 5,483,741 Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice | 275 | 1994 | |
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| 5,494,207 Wire bonder transducer arrangement and method | 23 | 1994 | |
| 5,607,096 Apparatus and method for ultrasonic bonding lead frames and bonding wires in semiconductor packaging applications | 10 | 1996 | |
| 5,611,478 Lead frame clamp for ultrasonic bonding | 35 | 1996 | |
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| 4,757,933 Ultrasonic weld location mask and method of use | 13 | 1987 | |
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| 5,469,072 Integrated circuit test system | 37 | 1993 | |
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| 5,517,752 Method of connecting a pressure-connector terminal of a device with a terminal electrode of a substrate | 49 | 1993 | |
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| 5,406,210 Apparatus and method for testing bare dies with low contact resistance between the die and testing station | 41 | 1993 | |
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| 4,444,349 Wire bonding apparatus | 34 | 1982 | |
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| 5,451,165 Temporary package for bare die test and burn-in | 95 | 1994 | |
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| 5,506,514 Electrical interconnect using particle enhanced joining of metal surfaces | 36 | 1995 | |
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| 5,676,304 Method of bonding a contact-type thin film magnetic head element to a supporting beam | 7 | 1996 | |
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| 4,475,681 Bonder apparatus | 29 | 1982 | |
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| 4,513,190 Protection of semiconductor wire bonding capillary from spark erosion | 54 | 1983 | |
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| 5,572,140 Reusable carrier for burn-in/testing on non packaged die | 50 | 1993 | |
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| 5,603,444 Ultrasonic bonding machine and resonator thereof | 24 | 1996 | |