US Patent No: 6,045,026

Number of patents in Portfolio can not be more than 2000

Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems

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Importance

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Abstract

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A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID21450

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Farnworth, Warren M Nampa, ID 1019 25477
Hembree, David R Boise, ID 451 10519
Hess, Michael E Kuna, ID 39 393
Jacobson, John O Boise, ID 69 1587
Wood, Alan G Boise, ID 513 17387

Cited Art Landscape

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (3)
5,326,428 Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability 222 1993
5,478,779 Electrically conductive projections and semiconductor processing method of forming same 88 1994
5,483,741 Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice 284 1994
 
NATIONAL SEMICONDUCTOR CORPORATION (3)
5,494,207 Wire bonder transducer arrangement and method 23 1994
5,607,096 Apparatus and method for ultrasonic bonding lead frames and bonding wires in semiconductor packaging applications 10 1996
5,611,478 Lead frame clamp for ultrasonic bonding 35 1996
 
AMERICAN TECHNOLOGIES, INC., A NV CORP. (1)
4,757,933 Ultrasonic weld location mask and method of use 13 1987
 
FREESCALE SEMICONDUCTOR, INC. (1)
5,469,072 Integrated circuit test system 37 1993
 
FUJITSU LIMITED (1)
5,517,752 Method of connecting a pressure-connector terminal of a device with a terminal electrode of a substrate 51 1993
 
GEC-MARCONI LIMITED (1)
5,406,210 Apparatus and method for testing bare dies with low contact resistance between the die and testing station 42 1993
 
KULICKE & SOFFA INVESTMENTS, INC. (1)
4,444,349 Wire bonding apparatus 34 1982
 
Minnesota Mining and Manufacturing Company (1)
5,451,165 Temporary package for bare die test and burn-in 96 1994
 
NANOPIERCE TECHNOLOGIES, INC. (1)
5,506,514 Electrical interconnect using particle enhanced joining of metal surfaces 36 1995
 
Nipponhatsujyo Kabushikikaisha (1)
5,676,304 Method of bonding a contact-type thin film magnetic head element to a supporting beam 7 1996
 
SILICON VALLEY BANK (1)
4,475,681 Bonder apparatus 29 1982
 
SMALL PRECISION TOOLS, INC. (1)
4,513,190 Protection of semiconductor wire bonding capillary from spark erosion 58 1983
 
SUNRIGHT LIMITTED (1)
5,572,140 Reusable carrier for burn-in/testing on non packaged die 50 1993
 
ULTEX CORPORATION (1)
5,603,444 Ultrasonic bonding machine and resonator thereof 28 1996

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (4)
6,427,899 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 2 2001
6,419,143 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 2 2001
6,619,532 Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 1 2002
6,851,597 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 0 2002
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
7,219,419 Component mounting apparatus including a polishing device 2 2003
 
PANASONIC CORPORATION (1)
7,549,567 Component mounting tool, and method and apparatus for mounting component using this tool 4 2007