Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6045026
SERIAL NO

09027690

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID19009

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Farnworth, Warren M Nampa, ID 852 29239
Hembree, David R Boise, ID 377 12864
Hess, Michael E Kuna, ID 36 437
Jacobson, John O Boise, ID 61 1706
Wood, Alan G Boise, ID 414 20035

Cited Art Landscape

Patent Info (Count) # Cites Year
 
Minnesota Mining and Manufacturing Company (1)
* 5451165 Temporary package for bare die test and burn-in 96 1994
 
NANOPIERCE TECHNOLOGIES, INC. (1)
* 5506514 Electrical interconnect using particle enhanced joining of metal surfaces 40 1995
 
American Technology, Inc. (1)
* 4757933 Ultrasonic weld location mask and method of use 13 1987
 
ULTEX CORPORATION (1)
* 5603444 Ultrasonic bonding machine and resonator thereof 36 1996
 
National Semiconductor Corporation (3)
* 5494207 Wire bonder transducer arrangement and method 23 1994
* 5607096 Apparatus and method for ultrasonic bonding lead frames and bonding wires in semiconductor packaging applications 10 1996
* 5611478 Lead frame clamp for ultrasonic bonding 38 1996
 
FREESCALE SEMICONDUCTOR, INC. (1)
* 5469072 Integrated circuit test system 42 1993
 
MICRON TECHNOLOGY, INC. (3)
* 5326428 Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability 230 1993
* 5478779 Electrically conductive projections and semiconductor processing method of forming same 88 1994
* 5483741 Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice 292 1994
 
KULICKE & SOFFA INVESTMENTS, INC. (1)
* 4444349 Wire bonding apparatus 34 1982
 
FUJITSU LIMITED (1)
* 5517752 Method of connecting a pressure-connector terminal of a device with a terminal electrode of a substrate 56 1993
 
SILICON VALLEY BANK (1)
* 4475681 Bonder apparatus 29 1982
 
Nipponhatsujyo Kabushikikaisha (1)
* 5676304 Method of bonding a contact-type thin film magnetic head element to a supporting beam 7 1996
 
Sunright Limited (1)
* 5572140 Reusable carrier for burn-in/testing on non packaged die 50 1993
 
GEC-MARCONI LIMITED (1)
* 5406210 Apparatus and method for testing bare dies with low contact resistance between the die and testing station 47 1993
 
Small Precision Tools, Inc. (1)
* 4513190 Protection of semiconductor wire bonding capillary from spark erosion 67 1983
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
U.S. BANK NATIONAL ASSOCIATION (1)
* 2003/0057,260 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 0 2002
 
PANASONIC CORPORATION (1)
7549567 Component mounting tool, and method and apparatus for mounting component using this tool 4 2007
 
MICRON TECHNOLOGY, INC. (4)
* 6427899 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 3 2001
* 6419143 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 3 2001
6619532 Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 2 2002
6851597 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 1 2002
 
BAKER HUGHES INCORPORATED (2)
8997855 Reduction of expansion force via resonant vibration of a swage 0 2007
* 2008/0073,076 REDUCTION OF EXPANSION FORCE VIA RESONANT VIBRATION OF A SWAGE 1 2007
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
* 7219419 Component mounting apparatus including a polishing device 4 2003
 
COMPONENTZEE, LLC (1)
* 9577358 Fluid pressure activated electrical contact devices and methods 0 2015
* Cited By Examiner