Vacuum dispense method for dispensing an encapsulant and machine therefor
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United States of America Patent
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Apr 4, 2000
Issued Date -
N/A
app pub date -
Nov 20, 1997
filing date -
Dec 29, 1994
priority date (Note) -
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status (Latency Note)
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Abstract
A microelectronic assembly such as an assembly of a semiconductor chip and mounting substrate is encapsulated by applying an encapsulant to the assembly while maintaining the assembly under a subatmospheric pressure to minimize gas entrapment in the encapsulant. After the encapsulant flow around the assembly, a higher pressure is applied, causing collapse of any voids in the encapsulant. The encapsulant is then cured. The method is particularly useful with assemblies wherein a chip is spaced from the substrate so that the encapsulant flows between the chip and substrate.
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