Solder balltape and method for making electrical connection between a head transducer and an electrical lead
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 4, 2000
Grant Date -
N/A
app pub date -
Jul 11, 1996
filing date -
Jul 11, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A solder balltape comprised of an elongated tail with a ball of solder formed at one end. A plurality of the balltape structures are positioned on a carrier strip of solder. The balltape is positioned in contact with a transducer pad on a magnetic read/write slider and an electrical lead pad. A pulse of focused laser radiation is directed at the ball part of the balltape and a right angle fillet joint is formed. A subsequent laser pulse or a sharpened blade is used to remove the tail from the newly formed fillet joint.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully