Computer card with a printed circuit board with vias providing strength to the printed circuit board
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United States of America Patent
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-
Apr 4, 2000
Grant Date -
N/A
app pub date -
Nov 16, 1998
filing date -
Nov 16, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
A card for a computer is described which has a printed circuit board having a substrate which includes a number of layers, and vias extending into the substrate. By configuring the vias correctly they can be used for distributing stresses on the printed circuit board which may result from a combined effect of a change in temperature and a mismatch between thermal coefficients of the printed circuit board and an electronic device mounted to the printed circuit board. The vias may be configured by providing more deep vias which extend through more layers of the substrate, by positioning the deeper vias correctly, and by controlling the dimensions of contact pads which are connected to the vias. By correctly configuring the vias, stresses on the printed circuit board can be reduced to and extent which would allow for a substrate having fewer layers and having larger surface areas.
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