Method of forming a metal line utilizing electroplating
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United States of America Patent
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Apr 11, 2000
Grant Date -
N/A
app pub date -
Mar 24, 1998
filing date -
Mar 24, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to a method of forming a metal line. A photoresist layer is formed on a substrate and patterned so that a metal part on the substrate is exposed. A metal seed layer is then deposited over the photoresist layer utilizing a directional deposition technique. A portion of the metal seed layer is then removed. A metal plating is then formed on the metal seed layer utilizing a technique selected from the group consisting of electroplating and electroless plating. The photoresist layer is then removed.
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