Metalorganic decomposition deposition of thin conductive films on integrated circuits using reducing ambient
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United States of America Patent
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Apr 11, 2000
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N/A
app pub date -
Jul 10, 1998
filing date -
Jul 10, 1998
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Abstract
A method for depositing conductive material inside openings within an integrated circuit uses chemical solution deposition. The method includes applying the integrated circuit having the openings with a metalorganic decomposition precursor. The metalorganic decomposition precursor on the integrated circuit is pyrolyzed in a reducing ambient to form a layer of conductive material. For example, if the reducing ambient includes one of hydrogen gas, or a hydrogen and nitrogen gas mix, reactive hydrogen, or ultra high vacuum substantially devoid of oxygen, a conductive layer of metal forms from pyrolyzing the metalorganic decomposition precursor in such a reducing ambient. If the reducing ambient includes reactive nitrogen, a conductive layer of metal nitride forms from pyrolyzing the metalorganic decomposition precursor in such a reducing ambient. The present invention which uses metalorganic decomposition precursors which are chemical solutions with high wetability may be used to particular advantage for depositing a barrier layer and copper within small geometry openings for metal interconnects.
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