Stackable high density RAM modules
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 11, 2000
Grant Date -
N/A
app pub date -
Aug 31, 1998
filing date -
Aug 31, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A stacked circuit assembly is provided for mounting memory modules in close proximity to an integrated circuit. The assembly includes an integrated circuit mounted on a printed circuit board and at least one stacked printed circuit board mounted in substantially parallel arrangement with respect to the printed circuit board on which the integrated circuit is mounted. A memory module is mounted for electrical connection on a surface of the stacked printed circuit board and an interface connector is mounted on facing surfaces of the printed circuit board and the stacked printed circuit board, thereby providing means for both mechanical and electrical connection between the boards. The integrated circuit and the memory module are mounted in parallel relationship with respect to one another for electrical interconnection through the boards and the interface connectors, thereby reducing the physical distance between the integrated circuit and the memory module.
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