Universal unit strip/carrier frame assembly and methods
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 18, 2000
Grant Date -
N/A
app pub date -
Jan 23, 1998
filing date -
Mar 4, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of making a microelectronic assembly includes providing a flexible tape having first and second surfaces with a plurality of connection components in a central region of the flexible tape, providing a carrier frame having top and bottom surfaces and a slot extending therebetween and placing the flexible tape in contact with the top surface of the carrier frame. Next a resilient element is provided on each connection component and the flexible tape is passed through the slot so that the flexible tape disengages from the top surface of the carrier frame, passes through the slot and engages the bottom surface of the carrier frame. The carrier frame includes one or more interior edges defining the slot and a cut-out region contiguous with one end of the slot. The cut-out region also extends between the top and bottom surfaces of the carrier frame and the width of the cut-out region is greater than the width of the flexible tape so that at least one side border region of the flexible tape is pivotally secured to the carrier frame.
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