Magnetic alignment apparatus and method for self-alignment between a die and a substrate
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United States of America Patent
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Apr 18, 2000
Grant Date -
N/A
app pub date -
Apr 29, 1998
filing date -
Apr 29, 1998
priority date (Note) -
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Abstract
A magnetic alignment apparatus (20) is provided for aligning a semiconductor die (11) and a packaging substrate (12) to enable aligned mounting therebetween. The alignment apparatus (20) includes a first magnetic device (23) coupled to the die (11) and adapted to generate a first magnetic field (25) oriented relative to a first reference point (26) of the die (11). A second magnetic device (27) is coupled to the substrate (12) and adapted to generate a second magnetic field (28) oriented relative to a second reference point (30) of the substrate (12). The first magnetic field (25) and the second magnetic field (28) cooperate to directionally align the first reference point (26) of the die substantially with the second reference point (30) of the substrate (12).
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