Method of forming electrically conductive pillars
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United States of America Patent
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-
Apr 18, 2000
Issued Date -
N/A
app pub date -
May 15, 1997
filing date -
Aug 17, 1993
priority date (Note) -
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status (Latency Note)
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Abstract
A method of forming electrically conductive pillars on a printed circuit board by providing a printed circuit board having a plurality of electrical traces and forming a plurality of elongate, electrically conductive pillars of superimposed layers of solder and conductive polymer on the printed circuit board. The elongate, electrically conductive pillars are connected by a first end to the electrical traces of the printed circuit board and extend substantially perpendicularly from the printed circuit board such that a second end of each of the plurality of elongate, electrically conductive pillars lies in substantially a common plane which is substantially perpendicular to and above said printed circuit board.
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